Paper Title
Studies on Filler Particles Morphology Towards The Performance Improvement of Cryocooler Based Cryosorption Pump

Cryosorption pump is the best possible solution to achieve a clean, ultra-high vacuum free of any external magnetic and electrical disturbances for fusion and space applications. In cryosorption pump vacuum is produced by adsorption. In adsorption, surrounding gas molecules losses their kinetic energy when come in contact with a cold adsorbent. The gas molecules absorbed on the cold adsorbent by weak Van der walls forces. Cryosorption pump consists of three major parts, a) metallic panel, b) epoxy adhesive, and c) adsorbent. The temperature of adsorbent plays a significant role in the adsorption of gas molecules. The lowest possible temperature is achieved by transferring the cold from the cryogen/cryocooler through adhesive to the adsorbent. Therefore, adhesive’s thermal conductivity is a key factor for the performance improvement of the cryosorption pump. The adhesive’s thermal conductivity can be enhanced by mixing the high thermal conductivity fillers. The adhesive-filler thermal conductivity’s data towards the improved performance of cryosorption pump is scarce and not available in open literature. Therefore, in this paper we have shown the thermal conductivity data of adhesive/adhesive-filler composite adhesive towards the development of cryosorption pump. This study includes the effect of various of filler such as cuboidal and cylindrical sizes (millimeter, micron, etc.). The Ansys software is used for the determination of composite’s thermal conductivity and will be helpful for the performance improvement of cryocooler-basedcryosorption pump. Keywords - Thermal Conductivity, Cryosorption Pump, Filler Particles Morphology, Epoxy-Filler Composite Adhesive