Paper Title
Development of Bonding Strength Experimental Set-Up at Cryogenic Temperature

In this manuscript, we discuss the experimental setup developed for the measurement of bonding strength at cryogenic temperature. The developed setup will find the bonding strength of pure epoxy as well as epoxy filled with filler particles. As we know the thermal property of epoxy adhesive change drastically at very low temperatures and commercially available testing machines are not suitable to work at cryogenic temperatures. Therefore, we have developed a bonding strength experimental setup that works at cryogenic temperature (~77 K) with higher accuracy. We have calibrated the experimental setup data with the data of the Universal Testing Machine (UTM) at 300 K. The developed experimental setup data is comparable and matches the accuracy of approximately 95 % with the UTM data. This work will be useful for the optimization of the filler’s volume fraction into the epoxy adhesive.