Paper Title :Development of Bonding Strength Experimental Set-Up at Cryogenic Temperature
Author :Ravi Verma
Article Citation :Ravi Verma ,
(2023 ) " Development of Bonding Strength Experimental Set-Up at Cryogenic Temperature " ,
International Journal of Mechanical and Production Engineering (IJMPE) ,
pp. 25-27,
Volume-11,Issue-3
Abstract : In this manuscript, we discuss the experimental setup developed for the measurement of bonding strength at
cryogenic temperature. The developed setup will find the bonding strength of pure epoxy as well as epoxy filled with filler
particles. As we know the thermal property of epoxy adhesive change drastically at very low temperatures and commercially
available testing machines are not suitable to work at cryogenic temperatures. Therefore, we have developed a bonding
strength experimental setup that works at cryogenic temperature (~77 K) with higher accuracy. We have calibrated the
experimental setup data with the data of the Universal Testing Machine (UTM) at 300 K. The developed experimental setup
data is comparable and matches the accuracy of approximately 95 % with the UTM data. This work will be useful for the
optimization of the filler’s volume fraction into the epoxy adhesive.
Type : Research paper
Published : Volume-11,Issue-3
DOIONLINE NO - IJMPE-IRAJ-DOIONLINE-19556
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Copyright: © Institute of Research and Journals
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Published on 2023-06-03 |
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