Paper Title :Particle-Fluid Simulation of Flip Chip Capillary Under Fill Process Using Discrete Phase Model
Author :Fei Chong Ng, Aizat Abas
Article Citation :Fei Chong Ng ,Aizat Abas ,
(2017 ) " Particle-Fluid Simulation of Flip Chip Capillary Under Fill Process Using Discrete Phase Model " ,
International Journal of Mechanical and Production Engineering (IJMPE) ,
pp. 92-96,
Volume-5,Issue-10
Abstract : This paper investigates a capillary underfill flow in flip-chip encapsulation with the consideration of fillerparticles
that is being dispersed in the epoxy resin to form underfill fluid. Two-ways coupled particle/fluid simulation have
been implemented for the application of capillary underfill using discrete phase model (DPM). The flow front together with
the instantaneous positions of filler particles and its velocity have been depicted at selected filling progression. The pressure
contour and velocity streamlines of the underfill flow were computed and presented. The necessity of considering the
particulate phase of filler particles in simulating the underfill process have been emphasized. While past numerical studies
regard the underfill as single immiscible fluid upon neglecting the filler, current methodology would shed a new light in the
future of underfill researches and optimization of filler technology.
Indexed Terms―Capillary underfill,Discrete phase model (DPM),Flip-chip encapsulation
Type : Research paper
Published : Volume-5,Issue-10
DOIONLINE NO - IJMPE-IRAJ-DOIONLINE-10563
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Copyright: © Institute of Research and Journals
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Published on 2018-02-15 |
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